Die & Wire Bond Vision Inspection
Die & Wire Bond Vision Inspection Handler A high-performance stereoscopic line-scanning 3D vision handler designed to inspect the quality of dies and wire bonds in the front-end semiconductor process, filtering o...
Penang, MalaysiaDBC/AMB Substrate-Level Segregation
DBC/AMB Substrate-Level Segregation HandlerIt is an automated DBC/AMB segregation handler which also features advanced AOI system for 3D wire bond inspections and is integrate-able with any 3rd party test systems.
Penang, Malaysia- Trusted Seller
Malacca, Malaysia - Trusted Seller
Malacca, Malaysia
Tip: Enter manufacturer, model or keyword
