New Wafer Grinding in Guangdong, China

Mechanical spindle wafer grinder

Main purpose of the equipment: Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging ) The equipment adopts a...

Air spindle semi automatic wafer grinder

□ Semi automatic single axis wafer back thinning □ Grindable wafer size 4-8 " □ Single axis single disc mode □ Online thickness measurement □ Corresponding to irregular specifications MDXZ-G300HG □ Semi automatic...

Air spindle full automatic wafer grinder

□ Fully automatic wafer back thinning □ Grindable wafer size4 “/5”/6”/8” □ Two axis three disc mode □ Online thickness measurement □ Wafer cleaning and drying □ Dry in,dry out standard 2 air spindle + 3 mechanica...

Panasonic SP60 PLATE KXFB0033A01

• Manufacturer: Panasonic

MDG21503NC Full automatic wafer grinder

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MDG21503NC Full automatic wafer grinder for semiconductor

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Full automatic wafer grinder MDG33004SNC for semiconductor

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SGM-450V

SGM-450V Semiconductor industry, electronic connector industry, ceramic industry, tungsten steel industry, precision and high precision parts processing industry, precision mold industry, etc.