New Wafer Slicing / Dicing for sale in China

HGTECH LUSD3310 Fully Automatic SiC Wafer Modification and Cutting Equipment

Manufacturer: Hgtech

The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Comb...

Wuhan, China

YBDX160 Diamond Multi-wire Saw

Manufacturer: Beijing Sinopoly Technology

Model.160 is mainly used for highly speeding and highly precisely slicing 2" , 4" ,6" sapphire ingot in mass prodution. The equipment can achieve a very good stable performance featured with low noise, low vibrat...

Beijing, China

DX2231HC Multi-wire Saw

Manufacturer: Beijing Sinopoly Technology

Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

Beijing, China

DX485C Multi-wire Saw

Manufacturer: Beijing Sinopoly Technology

Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

Beijing, China

HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment

Manufacturer: Hgtech

Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...

Wuhan, China