New Die Bonders in China

Submicron Semi-Auto Eutectic Die Bonder with table

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Submicron Manual Rotary Die Bonder RYW-ETB05

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Submicron Manual Rotary Die Bonder RYW-ETB05S

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Submicron Semi-Auto Eutectic Die Bonder RYW-ETB05B

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Manual Epoxy and Eutectic Die Bonder

MDSJHYZPGJ0225 Epoxy and Eutectic Die Bonder 1. Effective solution without touching the surface of the chip Clamp edge collapse problem 2. Automatic scribing, dispensing, sticking, automatic rebound height detec...

Dual head high speed Die Bonder

MDAX64DI-25-3 Planar Dual head high-speed Die Bonder Applicable to SMD2020 1010 2121 2835 5730, filament, etc 一、Model characteristics 1. Independent double head die bonding, double stamp arm, double wafer search ...

MDAX-FC810 flip chip die bonder

MDAX-FC810 flip chip die bonder This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips A...

MD-JC360-D Syringe type die bonder

Automatic die sorter

• Manufacturer: Minder Hightech

MDDB-LA838 Die attach

• Manufacturer: Minder Hightech

Equipment specifications Control specifications

MD-DDM08 die demounter

• Manufacturer: Minder Hightech

Product features： 1. Suitable for wafer peeling process of 8 inches and below; 2. Adopting non-contact film stripping to prevent damage to grains and improve product qualification rate; 3. Simple and convenient o...

Film to Film Die Sorter MDAX-DS380F

• Manufacturer: Minder Hightech

1， Support 12-8 inch wafer input and 12-8 inch wafter output. (support customize wafer sizes) 2， Support multiple die sizes(0.3-25mm). need conversion kits) 3， With strong mapping function. As well as BIN functio...

Automatic die bonder manual upload and down load

Md-jc360: 8inch wafer die bonder manual upload and dowload. | Md-jc380: 12inch wafer die bonder manual upload and download

Manual Epoxy die bonder

Features: 1. It can realize the function of automatic scribing of various patterns such as single-point dispensing, rectangle, rice character, etc. 2. Realize the soft contact of the suction nozzle, effectively s...

High precision die bonder MD-1412

This die bonder is high precision die bonder use for high requirment die bonding, it first picking die by swing to a holder, which can calibrate the angle, and then re-pick to the leadframe by linear guide.