Used Die Bonders in China

Submicron Semi-Auto Eutectic Die Bonder with table

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Submicron Manual Rotary Die Bonder RYW-ETB05

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Submicron Manual Rotary Die Bonder RYW-ETB05S

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Submicron Semi-Auto Eutectic Die Bonder RYW-ETB05B

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Manual Epoxy and Eutectic Die Bonder

MDSJHYZPGJ0225 Epoxy and Eutectic Die Bonder 1. Effective solution without touching the surface of the chip Clamp edge collapse problem 2. Automatic scribing, dispensing, sticking, automatic rebound height detec...

Dual head high speed Die Bonder

MDAX64DI-25-3 Planar Dual head high-speed Die Bonder Applicable to SMD2020 1010 2121 2835 5730, filament, etc 一、Model characteristics 1. Independent double head die bonding, double stamp arm, double wafer search ...

MDAX-FC810 flip chip die bonder

MDAX-FC810 flip chip die bonder This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips A...

MD-JC360-D Syringe type die bonder

Automatic die sorter

• Manufacturer: Minder Hightech

MD-DDM08 die demounter

• Manufacturer: Minder Hightech

Product features： 1. Suitable for wafer peeling process of 8 inches and below; 2. Adopting non-contact film stripping to prevent damage to grains and improve product qualification rate; 3. Simple and convenient o...

MDDB-LA838 Die attach

• Manufacturer: Minder Hightech

Equipment specifications Control specifications

Film to Film Die Sorter MDAX-DS380F

• Manufacturer: Minder Hightech

1， Support 12-8 inch wafer input and 12-8 inch wafter output. (support customize wafer sizes) 2， Support multiple die sizes(0.3-25mm). need conversion kits) 3， With strong mapping function. As well as BIN functio...

ASM AD830

• Manufacturer: ASM
• Model: AD830

This manual is to provide trained engineer or technician with the AD830 die bonder interediate setup and servicing instruction. includes: ●Bond quality problem and solution, grease information and setup tools use...

ASM AD8312

• Manufacturer: ASM

The AD838 is an automatic high speed epoxy die bonder with up to 4" (101.6 mm) substrate width handling capability, It is highly flexible in handling wide range of die sizes for your IC and discrete packages.

2007 SHINKAWA SPA300 Super

• Manufacturer: Shinkawa
• Model: SPA-300

Equipment name: Solidifying machine and laminating machine