Used Pcb Assembly in Bavaria, Germany

2008 tosok DBD4600

• Manufacturer: Tosok
• Model: DBD4600

DA_TOSOK DBD4600_TG24

2009 tosok DBD4600

• Manufacturer: Tosok
• Model: DBD4600

DA_TOSOK DBD4600_TG32

2015 tosok DBD4600

• Manufacturer: Tosok
• Model: DBD4600

DA_TOSOK DBD4600_TG101

2007 Longhill Industries LONGHILL_LH-860

• Manufacturer: Longhill Industries

LONGHILL WAFER MOUNT LONGHILL_LH-860LONGHILL WAFER MOUNT LONGHILL_LH-860 LONGHILL WAFER MOUNT LONGHILL_LH-860LONGHILL WAFER MOUNT LONGHILL_LH-860

2011 Tazmo Co.,Ltd. Tazmo Mounter 4

• Manufacturer: Tazmo Co.,Ltd.

TWS-M3111 Other information: Software Version TWS-M3111 Electric Schematic Number 81152323 | Power requirements: 220 V     13.0 A     75.0 A(2)     50/60 Hz     3 Phase | Weight: 3,757  lb  (1,704 kg)

2003 fujiwa TEP-250

• Manufacturer: fujiwa

Mold Press Weight: 17,637  lb  (8,000 kg)

1999 Trikon Tech Ltd. Sigma FxP200 RevA

• Manufacturer: Sigma

It´s a Trikon Sigma FxP200 with 4 Std RevA DEP Chambers, 1 RevA HSE (not complete), 1 MKII Heat Chamber. Brooks MX800 Platform with 2 Swing Out VCE6 Loadlocks. The Platform is upgradet from T5 Controller (MX800) ...

2017 PVA SPA Waferscale WS300 (MET902-03)

Waferscale for 8" STD / 8" Taiko / 12" STD/ 12" Taiko Wafer weighing system - Filmthickness

2015 PVA SPA Waferscale WS200 (MET902-02)

Waferscale for 8" Wafer STD Wafer weighing system - Filmthickness

2001 Canon 5500iz

• Manufacturer: Canon

'- 12" Standard Wafer Chuck and 12" wafer handling system - SMIF type reticle loading ports and reticle changer unit- Pellicle Particle checker installed - Hg-lamp will be rmoved prior shipping- Coolant will be r...

2018 Tesec TESEC_TURRET

• Manufacturer: Tesec

TESEC Tester TESEC_TURRET

2012 Tesec TESEC_TURRET

• Manufacturer: Tesec

TESEC Tester TESEC_TURRET

2016 SRM TD16

• Manufacturer: SRM

TD16 SRM Electrical Test

2016 Tesec 4330IH

• Manufacturer: Tesec

4330IH TESEC HOT & COLD TEST

2016 Nexx Apollo PVD

The Nexx Apollo PVD system is a fully automated Physical Vapor Deposition (PVD) tool using a multiple wafer multiple chamber design. The system deposits thin metal films used in interconnect metallization on wafe...