MDLB-ASD2C2D automatic coating and developing machine
MDLB-ASD2C2D automatic coating and developing machine The equipment adopts a stainless steel frame, and the inner and outer sheet metal are stainless steel mirror panels. The bottom of the equipment is equipped w...
Guangzhou, China
MDXN-31D4 High precision double-sided lithography machine
MDXN-31D4 High precision double-sided lithography machine Purpose and characteristics This equipment is mainly used for the development and production of small and medium-sized integrated circuits, semiconductor ...
Guangzhou, China
SUSS MA150CC
- Manufacturer: SÜSS MicroTec
- Model: MA150
SUSS MA150CC MASK ALIGNER AS-IS MANUAL TOPSIDE ALIGNER WAFER SIZE: 150MM AVAILABLE IN WAREHOUSE
Hong Kong
Spin coater without temperature
---Spin Coater The Spin Coater is a device that drips all kinds of glue on a high-speed rotating substrate and uses centrifugal force to uniformly coat the glue on the substrate. The thickness of the film depends...
Guangzhou, China
2007 KARL SUSS MA150e
- Manufacturer: SÜSS MicroTec
- Model: MA150e
Manufacturing process: photolithography | Inch: 6
Tokyo, Japan- Tokyo, Japan
- Tokyo, Japan
- Tokyo, Japan
- Tokyo, Japan
1995 CANON MPA600SUPER
- Manufacturer: Canon
- Model: MPA600
Manufacturing process: photolithography | Inch: 6
Tokyo, Japan- Tokyo, Japan
Mask Aligner
MOS-2A Mask Aligner Mask Size: a. 100 x 100 x 2 ~ 3 mm b. 75 x 75 x 2 ~ 3 mm c. 65 x 65 x 2 ~ 3 mm Substrate Size: 35 ~ 75 mm OD Exposure Resolution: 2 µm Mask and Substrate Move Range: X,Y≥±2.5mm; q (Rotating) ≥...
SingaporeMDXN-43D4 High precision mask aligner
MDXN-43D4 High precision mask aligner Purpose and characteristics This equipment is designed according the needs of market. Can do substrate below 100*100mm. it suitable for one time exposure product. Can do like...
Guangzhou, China
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