CHAMBER 1 GAS BOX CONFIG GAS 1 Aera TC FC-R7800 SiH4(10%)/N2 500SCCM GAS 2 Aera FC-7700 N2O 2000SCCM GAS 3 Aera FC-7700 O2 100SCCM GAS 4 Aera FC-7700 CF4(0.424) 500SCCM PROCESS CHAMBER 1 CONGIF 250MMX250MM ...
PECVD (Plasma-Enhanced Chemical Vapor Deposition) systems use a plasma to deposit thin films at lower substrate temperatures for semiconductors, MEMS, optics and solar cells. Typical units include a vacuum chamber, RF or microwave source, gas delivery and mass flow controllers, vacuum pumps and process controllers. Used PECVD machines require attention to chamber contamination, gas handling, and control electronics when evaluating performance and compatibility with your process recipes.
Check chamber condition (erosion, deposits), showerhead and electrodes, RF/microwave generator and match network, mass flow controllers, vacuum pumps, heaters, control software/recipes, spare parts availability and maintenance records.
Purge and purge-certify gas lines, drain and secure process liquids, remove or secure fragile electronics, bolt down moving parts, cap vacuum ports, tag consumables, and coordinate with a shipper experienced in semiconductor equipment.
Yes — hazardous gas inventories, toxic/pyrophoric materials, refrigerants and batteries require declarations and permits. Export controls and customs paperwork for semiconductor tools may also apply; get decontamination and export documentation in advance.
Routine tasks include chamber cleaning, replacing O‑rings and showerheads, calibrating mass flow controllers, servicing vacuum pumps, checking RF matching, updating software, and following OEM maintenance schedules to preserve process repeatability.