Used Wafer Slicing / Dicing

ASAHI Dicing Blade H305RM-T3-030080 Lot of 4 New (7514)W

• Manufacturer: ASAHI

ASAHI Diamond Dicing Blade H305RM-T3-030080 Lot of 4 New (7514)W Item's are OLD Stock and in good cosmetic condition no sings of damage still in original cases. See pictures for more details. - Manufacturer: As...

Kulicke & Soffa UniPlus Hubless Dicing Blade B08EN-HL5M-F30 LOT of 10 NEW (6047)

• Manufacturer: Kulicke & Soffa

Kulicke & Soffa UniPlus Hubless Dicing Blade B08EN-HL5M-F30 LOT of 10 NEW (6047) R New old stock. 7 out of 10 are NOT used. The 3 are still in good condition. See pictures for more detail. - Manufacturer: Kulic...

K&S 980

• Manufacturer: Kulicke & Soffa

Like New 8″ wafer saw complete with integrated cleaner

2017 Meyer Burger DW 288

• Manufacturer: Meyer
• Model: DW 288

Less than 500 hours used on this tool. Spare Parts are also included. - This tool is also available through a lease-to-own option subject to credit approval

TSK A-WD-300T Dicing Saw Wafer Saw ���������������� ��������� 12���

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-300T

TSK A-WD-200T Dicing Saw Wafer Saw 8 ������������������� ���������

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-200T

YBDX160 Diamond Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Model.160 is mainly used for highly speeding and highly precisely slicing 2" , 4" ,6" sapphire ingot in mass prodution. The equipment can achieve a very good stable performance featured with low noise, low vibrat...

DX485C Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

DX2231HC Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

TSK A-WD-100A Dicing Saw ���������������

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-100A

Teikoku Wafer detaping machine EXR-1200 F2 Tape Remover

• Manufacturer: Teikoku

Dicing Machine AD2000T/S

• Manufacturer: SSMC

Achieved smallest footprint possible utilizing our own core technology. Feature1 nWorld's most efficient Dicing Machine Delivering fast X-axis (Up to 1,000mm/sec) and Y-axis (Up to 300mm/sec) processing speed. Lo...

ACCRETECH SS30

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS30

12-inch dicing machine Small footprint with highly stable structure. Compliant with varieties of work Feature1 nFootprint Small footprint with highly stable structure nCompliant with varieties of work ・300mm wafe...

ACCRETECH ML300Plus ⅡWH

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML300Plus-WH

12-inch laser dicing machine with wafer handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing The dicing machine is equ...

ACCRETECH SS10

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS10

Fastest and smallest 6-inch dicing machine. Improved operability with the 17-inch touch panel screen. The image-processing engine accommodates variety of work. Feature1 Fastest and smallest 6-inch dicing machine ...